Ruiyun Yu (于瑞云)’s academic page. Thanks for the template provided by AcadHomepage!

🧍‍♂️ Biography

Ruiyun Yu is a professor of the Software College, and the director of the Cyberspace Affairs Office at Northeastern University. He received his bachelor’s degree in mechanical engineering and automation, and MS and PhD degrees in computer science and technology from the Northeastern University in 1997, 2004, 2009, respectively. He serves as the director of the Industrial Internet Platform Application Innovation & Promotion Center of the Ministry of Industry and Information Technology, China, and the director of the Shenyang Core Node of the China Education and Research Network (CERNET). He also serves as the associate editor of IEEE Transactions on Industrial Informatics (IEEE TII). He is the Chief Scientist of a major project in the Industrial Internet Innovation and Development Program of the Ministry of Industry and Information Technology, a leading talent of “Xingliao Talent Program” of Liaoning Province, an Outstanding Science and Technology Researcher of Liaoning Province, and a leading talent of Shenyang City. He is also a Distinguished Member of the China Computer Federation (CCF), an Executive Committee Member of the CCF Internet of Things Technical Committee, a Committee Member of the Technical Committee on Visual Inspection of the China Society of Image and Graphics, and a Committee Member of the Standardization Working Committee of the Chinese Association of Automation (CAA). His research interests include industrial vision, time series analysis, 3D spatial intelligence, intelligent manufacturing systems, etc. He actively promotes technological innovation in the field of “intelligent manufacturing for integrated circuits” through conducting research on intelligent software, algorithms, and applications for IC processes such as front-end wafer fabrication, packaging substrate manufacturing, and advanced packaging. As a project leader, he has undertaken more than 30 research projects, including National Key R&D Program projects, high-quality development initiatives of the Ministry of Industry and Information Technology, and National Natural Science Foundation projects, with total funding exceeding 130 million yuan. He has achieved a series of innovative results in areas such as micro/nano-scale surface defect detection methods for integrated circuits, anomaly detection and quality prediction methods for precision manufacturing, and stability control methods for manufacturing processes. Many of these research outcomes have been deployed in industrial applications. Breakthroughs have been made in large model-based micro/nano-scale defect detection methods and the development of automatic optical inspection (AOI) equipments for chip packaging substrates. The achievement of Visual Inspection Technology for Ceramic Chip Packaging Substrates was launched at the National Science and Technology Communication Center. He has published over 110 academic papers in high impact journals and conferences including TKDE, TCSVT, TMECH, TII, ICCV, AAAI, INFOCOM, etc. He holds more than 30 authorized invention patents, has facilitated commercialization of 3 patent achievements with a commercialization value of 11.55 million yuan, led the development of 2 group standards, and participated in the formulation of 5 international standards and 1 national standard. He won 1 second prize for Science and Technology Progress Award from the China Instrument and Control Society, one first prize for Invention and Entrepreneurship Award from the China Association of Inventions, one Gold Award of the International Invention Exhibition, 1 second prize for National Teaching Achievement Awards, and 3 first prizes for Teaching Achievement Awards of Liaoning Province.

🔥 News

• 2026.03:  🎉🎉 Our paper addressed few-shot defect detection is accepted by ICME 2026!
• 2026.03:  🎉🎉 Our paper addressed few-shot metal surface defect automatic segmentation is accepted by ICME 2026!
• 2026.02:  🎉🎉 Our paper addressed single-image super-resolution in industrial intelligent detection is accepted by IEEE/ASME Transactions on Mechatronics!
• 2026.01:  🎉🎉 Our paper addressed 3D industrial defect detection on IC ceramic package substrate surfaces is accepted by IEEE Transactions on Circuits and Systems for Video Technology!
• 2025.11:  🎉🎉 Our paper addressed point cloud segmentation of integrated circuits package substrates surface defects is accepted by AAAI 2026!
• 2025.10:  🎉🎉 Our achievement, “Visual Inspection Technology for IC Ceramic Package Substrates,” was released at the National Science Communication Center and selected for its major scientific and technological achievements digital exhibit repository!
• 2025.08:  🎉🎉 Our “2D Surface Defect Dataset for IC Ceramic Package Substrates” was selected as one of the first exemplary high-quality datasets released by the National Data Administration!
• 2025.08:  🎉🎉 Our achievement “High-Precision Visual Inspection Technology and Application for IC Ceramic Package Substrates” won a Gold Medal at the 11th International Invention Exhibition!
• 2025.07:  🎉🎉 Our paper addressed 4D HDR scene segmentation is accepted by ECAI 2025!
• 2025.07:  🎉🎉 Our paper addressed 3D scene reconstruction is accepted by Digital Communications and Networks!
• 2025.06:  🎉🎉 Our paper addressed Integrated circuits package substrate anomaly detection is accepted by ICCV 2025! The new dataset CPS2D-AD proposed in the paper is currently the largest integrated circuit defect detection dataset in the world!
• 2025.05:  🎉🎉 Our paper addressed Time Series Analysis is accepted by Computer in Industry!
• 2025.03:  🎉🎉 Our paper addressed Few-shot metal surface segmenation is accepted by IEEE TIM!
• 2025.02:  🎉🎉 Our paper addressed Time Series Analysis is accepted by Neurocomputing!
• 2024.10:  🎉🎉 Our paper addressed Recommendation System is accepted by KBS!
• 2024.09:  🎉🎉 We acquire the funding from the key research and development projects of Liaoning Province (Research and Application of Key Technologies for Multi-modal Industrial Product Surface Defect Detection Large Model)!
• 2024.04:  🎉🎉 Our paper addressed Transferable recommendation is accepted by IEEE TKDE (CCF A)!
• 2024.03:  🎉🎉 Our paper addressed Weakly-supervised metal surface segmenation is accepted by IEEE TIM!
• 2023.12:  🎉🎉 Our large vision model for industrial surface defect detection Qing Que obtained Huawei Ascend Technology Certification!
• 2023.05:  🎉🎉 We acquire the funding from the Fundamental Research Funds for the Central Universities.
• 2023.01:  🎉🎉 Our paper addressed Real-time metal surface segmenation is accepted by IEEE TII!
• 2022.08:  🎉🎉 Our paper addressed Few-shot metal surface segmenation is accepted by IEEE TIM!

📖 Educations

• 2005.03 - 2009.01, Northeastern University, College of Information Science & Engineering, Ph.D. in Computer Application Technology
• 2001.09 - 2004.03, Northeastern University, College of Information Science & Engineering, M.S. in Computer Application Technology
• 1993.08 - 1997.07, Northeastern University, School of Mechanical Engineering & Automation, B.S. in Fluid Power Transmission & Control

📝 Publications

# co-first author

* corresponding author

Industrial Vision

1. VIGIL: Vision-Language Industrial Grounding for Few-shot Defect Detection
   Jianing Duan#, Yuting Wang#, Ruiyun Yu*, Bingyang Guo, Haoyuan Li, Bang An
   IEEE International Conference on Multimedia & Expo (ICME). 2026.
2. MetaDefectNAS: A Meta-Learning and Neural Architecture Search-Based Framework for Few-Shot Metal Surface Defect Automatic Segmentation
   Ruiyun Yu, Shi Zhen*, Haoyuan Li
   IEEE International Conference on Multimedia & Expo (ICME). 2026.
3. Auxiliary Information Flow for 3D Industrial Defect Detection on IC Ceramic Package Substrate Surfaces: Dataset and Benchmark
   Ruiyun Yu, Ziming Zhao, Shi Zhen
   IEEE Transactions on Circuits and Systems for Video Technology (TCSVT). 2026.
4. Hybrid-space Interaction Network for Single-Image Super-Resolution in Industrial Intelligent Detection
   Haoyuan Li, Ruiyun Yu*, Bingyang Guo, Shi Zhen, Zhengtao Zhang
   IEEE/ASME Transactions on Mechatronics (TMECH). 2026.
5. Point Cloud Segmentation of Integrated Circuits Package Substrates Surface Defects Using Causal Inference: Dataset Construction and Methodology
   Bingyang Guo, Qiang Zuo, Ruiyun Yu
   Proceedings of the AAAI Conference on Artificial Intelligence (AAAI). 2026.
6. Supplementary Prompt Learning for Vision-Language Models
   Rongfei Zeng, Zhipeng Yang, Ruiyun Yu, Yonggang Zhang
   International Journal of Computer Vision (IJCV). 2025.
7. Anomaly Detection of Integrated Circuits Package Substrates Using the Large Vision Model SAIC: Dataset Construction, Methodology, and Application [Paper]
   Ruiyun Yu, Bingyang Guo*，Haoyuan Li
   Proceedings of the IEEE/CVF International Conference on Computer Vision (ICCV). 2025.
8. Background-weaken Generalization Network for Few-Shot Industrial Metal Defect Segmentation [Paper]
   Ruiyun Yu, Haoyuan Li*, Bingyang Guo, Ziming Zhao
   IEEE Transactions on Instrumentation and Measurement(TIM).
9. Dynamic Reasoning Network for Image-level Supervised Segmentation on Metal Surface Defect [Paper]
   Ruiyun Yu, Bingyang Guo*, Kang Yang
   IEEE Transactions on Instrumentation and Measurement (TIM). 2024.
10. SPEED: Semantic prior and extremely efficient dilated convolution network for real-time metal surface defects detection [Paper]
    Bingyang Guo, Ruiyun Yu*, Kang Yang
    IEEE Transactions on Industrial Informatics(TII). 2023.
11. Selective prototype network for few-shot metal surface defect segmentation [Paper]
    Ruiyun Yu, Bingyang Guo*, Kang Yang
    IEEE Transactions on Instrumentation and Measurement (TIM). 2022.

Time Series Analysis

1. Distformer: Time-frequency Feature Distribution-Aware Transformer for Long-Term Time Series Prediction
   Ruiyun Yu, Y. Zhang, H. Li, M. Chen
   IEEE Sensors Journal. 2026.
2. A multiscale process-aware retention network for fault prediction in mixed-model production [Paper]
   Mingda Chen, Ruiyun Yu*, Zhiyuan Liang, Kun Li, Haifei Qi
   Computer in Industry(CI). 2025.
3. A triple-phase boost transformer for industrial equipment fault prediction [Paper]
   Ruiyun Yu*, Mingda Chen, Bing Liu
   Neurocomputing(NEUROCOMPUTING). 2024.
4. Is multi-level data enhancement helpful for knowledge graph? A new perspective on multimodal fusion [Paper]
   Kang Yang, Ruiyun Yu*, Bingyang Guo
   Knowledge-Based Systems(KBS). 2024.
5. Interaction Subgraph Sequential Topology-Aware Network for Transferable Recommendation [Paper]
   Kang Yang, Ruiyun Yu*, Bingyang Guo, Jie Li
   IEEE Transactions on Knowledge and Data Engineering(TKDE). 2024.
6. PAG-TSN: Ridership demand forecasting model for shared travel services of smart transportation [Paper]
   Jie Li, Fuyu Lin, Guangjie Han, Yifan Wang, Ruiyun Yu, Ann Move Oguti, Zhenglin Li
   IEEE Transactions on Intelligent Transportation Systems (TITS). 2023.
7. An algorithm with iteration uncertainty eliminate based on geomagnetic fingerprint under mobile edge computing for indoor localization [Paper]
   Jie Li, Liming Sun, Dongpeng Liu, Ruiyun Yu, Xingwei Wang
   Sensors. 2022.

3D Spatial Intelligence

1. DWT-3DRec: DeepJSCC-based wireless transmission for efficient 3D scene reconstruction using CityNeRF [Paper]
   Shaung Cao, Jie Li, Ruiyun Yu*, Xingwei Wang, Jianing Duan
   Digital Communications and Networks (DCN). 2025.
2. SA4D-HDR: Segment Anything with Neural Radiance Fields for 4D HDR Scenes [Paper]
   Jie Li, Yuke Zhang, Long Wang, Ruiyun Yu
   European Conference on Artificial Intelligence (ECAI). 2025.
3. Spatial-Aware Multi-Level Parsing Network for Human-Object Interaction [Paper]
   Zhan Su, Ruiyun Yu, Shihao Zou, Bingyang Guo, Li Cheng
   International Journal of Interactive Multimedia and Artificial Intelligence (IJIMAI). 2025.
4. Trans-UTPA: PSO and MADDPG based multi-UAVs trajectory planning algorithm for emergency communication [Paper]
   Jie Li, Shuang Cao, Xianjie Liu, Ruiyun Yu, Xingwei Wang
   Frontiers in Neurorobotics. 2023.
5. CD2: Fine-grained 3D mesh reconstruction with twice chamfer distance [Paper]
   Rongfei Zeng, Mai Su, Ruiyun Yu, Xingwei Wang
   ACM Transactions on Multimedia Computing, Communications, and Applications (TOMM). 2023.
6. VTNFP: An image-based virtual try-on network with body and clothing feature preservation [Paper]
   Ruiyun Yu, Xiaoqi Wang, Xiaohui Xie
   Proceedings of the IEEE/CVF International Conference on Computer Vision (ICCV). 2019.
7. Skeleton Extraction of Character Model Based on Space Segmentation
   Ruiyun Yu, Zhan Su, Qian Xie, Jian Wang
   Chinese Journal of Computers. 2019, 42(09): 2049-2061.

🎓 Academic Appointment

• Chief Scientist, the major project on the Innovation and Development Program of Industrial Internet, Ministry of Industry and Information Technology, China
• Director, the Shenyang Core Node of the China Education and Research Network (CERNET)
• Associate Editor, IEEE Transactions on Industrial Informatics (IEEE TII)
• Director, the Industrial Internet Platform Application Innovation & Promotion Center, the Ministry of Industry and Information Technology, China
• Executive Committee Member, Technical Committee on Internet of Things (IoT), China Computer Federation (CCF)
• Committee Member, Technical Committee on Visual Inspection, China Society of Image and Graphics
• Committee Member, Standardization Working Committee, the Chinese Association of Automation (CAA)
• Vice Director, the Liaoning Province Graphics Society, China
• Deputy Director, the Liaoning Provincial Key Laboratory of Multidisciplinary Design Optimization Technology for Complex Equipment, China